In cyanide copper plating solution, no matter for iron and steel parts, zinc aluminum die castings, aluminum parts, etc., there will be copper accumulation as long as it is electrified. Therefore, it has good adhesion and is widely used. The domestic plating technology researchers have made a lot of research, but the cyanide copper plating process can not be screened due to the poor bonding force.

For example, acidic copper plating will replace copper with poor bonding force when it is not electrified, so it cannot be used as the bottom plating.

However, for ordinary copper pyrophosphate plating, although copper can be complexed with pyrophosphate, the oxygen between the two phosphorus is easily hydrolyzed and damaged, resulting in the presence of phosphate in the bath. The phosphate has no ability to complexed copper, but the quality of the plating solution is reduced. This is the most difficult technical problem for copper pyrophosphate plating manufacturers and can not be solved.

Therefore, the electroplating industry is in urgent need of a strong cyanide free copper plating process to replace cyanide copper plating.

The cfc-580 electroplating concentrate developed by the project process is composed of metal copper ions, complexing agents and conductive salts, which is used in the cyanide free alkaline copper plating process.

The origin of copper ions can be as follows: copper carbonate, copper sulfate, etc. enter the plating solution after being complexed by complexing agents. In the electroplating process, the supply of copper ions in the plating solution mainly comes from anodic dissolution.

The complexing agent is a new type of organic phosphine containing N substituent groups. This organic phosphine is not easy to be hydrolyzed and has a strong complexation effect on metal copper ions, which solves the technical problem that the conventional copper complex in the plating solution is simply hydrolyzed.

1. Anisotropy ① the complexing agent of cfc-580 concentrated solution in the cyanide free alkaline copper plating process of the project is a new type of organic phosphine containing N substitution groups. This organic phosphine is not simply hydrolyzed and has a strong complexing effect on metal ions. ② The project can replace the cyanide copper plating process, protect the environment and reduce pollution.

2. Progressiveness: ① the project process is superior to the cyanide copper plating process in terms of the super bonding force between the coating and the base metal, and the ductility and flexibility of the coating are equivalent to the cyanide copper plating process, which can completely replace the cyanide copper plating process. ② The project process can be directly plated on iron and steel parts, brass parts, zinc die castings (or aluminum parts dipped in zinc). The coating and the base metal have strong bonding force, which is feasible. ③ The composition of the plating solution is simple and stable, the operation is convenient, the protection cost is relatively low, and the production cost of users is reduced. The plating solution can be lax and the deep plating can be good. The coating has detailed crystallization and excellent ductility. The comprehensive quality of the coating can be comparable to that of cyanide copper plating. ④ The wastewater treatment is simple. Adjust the pH value to 1.0 with HCl or sulfuric acid to damage the complex, then adjust the pH value to 10 with alkali or lime milk, and then deposit it. After filtration, the content of copper can be lower than 0.5 mg / L, and the wastewater is treated and discharged.

Article source:Cyanide free alkali copper：http://www.newstar-china.com