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Analysis of common bad phenomena in cyanide copper plating process
1. The coating is rough and the color is dark red
1.从简至难扫除原则：先反省是不是温度太低，再有这种现象最多的氰化物不足引起，要常常剖 析与补加氰化物含量，正常镀液中铜离子可以由铜阳极补充，游离氰化钠要靠每日补加。
2.再有就是阳极钝化了，大家可以察看下阳极左近溶液是否发浅蓝色
阳极发作钝化现象 ，这时就应取出阳极清算并增加阳极面积 ，还有增加酒石酸钾钠含量。而假 如是阳极表面熟成较致密的黑色氧化铜，外层还附着一层胶体状沉积物的话，向镀液中补加酒石 酸钾钠，提高游离氰化钠的浓度也无济于事。依据我们团队经历判别，这故障就是锌杂质对镀液 的污染所致。这时就应先调整氰化钠正常含量, 去除铅和锌杂质时可以先将镀液加温到60℃，在 搅拌下参加0.2-0.4g/L的硫化钠，再参加2-4g/L的活性炭搅拌2h后过滤。也可停止小电流电解处 置。
二.镀层有针孔
1.先看下是否基体表面粗糙
2.这种不良最多的是因镀液有油或有机杂质 ，可用活性炭粉处置去除，在此我们乐将团队建议碱 铜缸要时常用碳粉处置，保持镀液的洁净。
3.铜含量过低或氰化钠含量过高 ，镀液析氢较大，可以剖析成分,调整铜与游离氰化钠至正常范 围
4.阴极电流密渡过大
5.阳极面积太小，依我们团队经历，氰化镀碱铜镀种保持阳极铜板时刻充足十分重要，对镀液稳 定，避免多类不良发作都有很粗心义，再有铜板不足，常常性补加亚铜来提升镀液中铜含量也是 十分不经济的
三.沉积速度慢 深镀才能差
1.先检下阴极电流密度是不是太小
2.再看是否阳极钝化或阳极面积太小，可以 增加阳极面积，提高氰化钠和提高镀液温度
3.再看是不是游离氰化钠太高
4.最后反省是不是溶液中有铬杂质污染我们的挂具使用破损后很容易藏粘性大的铬酐与重铬酸钾 钝化液等含铬杂质，
正常碰到这种杂质使用 保险粉处置 ，处置时应将镀液加热至60℃，在搅拌下参加0.2-0.4g/L的 保险粉，继续拌约30min后趁热过滤，然后试镀。在加有酒石酸盐的镀液中参加保险粉后还应参加 少量茜素，搅拌后并加以活性炭吸附，再停止过滤。
This article is from:http://www.newstar-china.com/
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