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Electroplating technology -- cleaning, copper plating and final plating
1. Cleaning:
清洁是重要的一环。一般清洁是有两个工序，化学除油( 在碱性溶液中借助皂化作用和乳化作用肃 清制件表面油污的进程 ) 及电解除油 (在含碱溶液中，以制件作为阳极或阴极，在电流作用下，肃清制件 表面油污的过)。就是把镀件打磨后遗留的蜡/油和灰尘洗去, 假如清洁做得不好，会影响往后的镀层粘附 力。
2.镀铜:
清洁后, 需要先镀铜， 起打底作用 (就仿佛女孩子化装打底一样)，让最后的镀层就会润滑亮堂。
镀铜一般分为三层: 碱铜，中性铜，酸铜
碱铜: 故明思意是碱性性的，起填平作用。是第一层的打底铜，有细微填平的作用， 能让往后的镀层更润 滑。
中性铜: 中和碱铜和酸铜的酸碱度 ( 为镀酸铜作准备 )， 也有细微填平作用。
酸铜: 带给镀件光泽度/ 厚度, 填平作用比碱铜/中性铜强。
3.最后镀层:
最后的镀层， 就是产品表面的颜色，最主要是装饰作用，也有填平效果。
除了电镀流程和每道工序的重要性外, 五金电镀在生产时呈现的问题能够也会给大家不少懊恼。
This article is from:http://www.newstar-china.com/
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