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Control the process parameters and stabilize the electroplating process
(1) current density request
规范半浸工艺不克不及低于18A/dm2；非半浸（超越半浸）工艺应精确计 算实践浸入镀液的面积，电流密度不克不及低于：14A/dm2，不然会形成 添加剂耗费不 屈衡，呈现质量成绩。
2镀液的温度请求
镀液温度应严厉掌握在39—41℃；过高会形成添加剂分化，过低会造 成添加剂积聚，两种状况都邑形成添加剂组分掉衡。
3版辊转速请求
版辊迁移转变线速应掌握在0.8—1.5m/s；因装备显示速度和实践有必定 误差，应停止校准。
4上液泵流量请求
上液泵流量不克不及低于10吨/H；因过滤芯的梗塞会使过滤机的流量减小 应活期、实时停止改换，周期不该超高30天。
5阴阳极间隔请求
阴阳极间隔应掌握在40-80mm，即能无效浪费能耗，又不会影响电镀 质量。
6阳极面积请求
包管阳极面积：阴极面积在1.5-2：1的规模内；过小的阳极面积会造 成添加剂相干组分耗费量增大、镀液组分掉调；普通而言要坚持铜球 与液面 平齐；阳极应 活期冲刷，避免铜球导电不良，同时防止零落的 阳极杂质净化镀液，周期不该超越一周。
7通电工夫请求
版辊入槽后不宜浸泡过长工夫，因如今镀镍层较薄，建议通电工夫为 版面接触液面后10-20S。
8初始电流请求
初始电流应设置在0.5-0.6的规模内，可以避免通电初始阶段版面发黑 的状况。
9镀液成分请求
镀液中硫酸铜浓度掌握规模180-230g/L；硫酸含量掌握规模50-60g/L 氯离子掌握规模80-120ppm；建议镀液天天加水起码一次，镀液化验 每周两次，并实时定量 调剂。
10添加剂弥补量请求
This article is from:http://www.newstar-china.com/
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