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What is the development of cyanide plating in metal plating technology
Present situation of cyanide electroplating in precious metal electroplating technology
氰化电镀技术因为其优胜的功能，在不一样的电镀设备镀种，依然被不一样程度的沿袭。
当前在电镀中含有氰化物的首要镀种及工序有：氰化镀锌、氰化镀镉、氰化镀铜、氰化镀黄铜（含氰化镀仿金）、氰化镀铜锡合金（含高锡青铜和低锡青铜）、氰化镀银、氰化镀金（含碱性、酸性及中性镀金）、高硅铝合金浸锌、无氰镀锌技术、电免除垢和氰化物-防染盐退镍技术等。氰化镀锌在国内当前仍约占镀锌槽液总量的10%~20%，而在发达国家（如美国）约占10%左右。
铁基体件、锌基合金件直接镀铜（预镀铜），当前在国内简直100%是选用氰化镀铜，只要极少数厂家用预镀镍替代氰化预镀铜，广东也是如此，就是在发达国家美国也占90%以上选用氰化镀铜。镀黄铜、镀铜锡合金和镀银当前国内都是选用氰化电镀技术。镀金选用碱性镀金、酸性镀金、中性镀金和亚硫酸盐镀金技术，碱性镀金、酸性镀金和中性镀金都是含氰技术，亚硫酸盐镀金属无氰技术，但其用量相对较少。高硅铝合金浸锌选用有氰多元合金浸锌和无氰多元合金浸锌技术。因为前者技术稳定性相对比较好，因而当前在广东电镀铝合金轮毂的工厂首要挑选有氰技术。此外，电免除油、除垢技术依然有少量厂家在槽液中增加氰化钠以进步其除垢效果。氰化钠—防染盐退镍技术仍被广泛应用。
This article is from:http://www.newstar-china.com/
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