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Understanding the composition of electroplating bath in electroplating process
① The deposited metal salt.
②与被沉积金属离子生成络合物的络合剂。
③增加电镀槽液导电性的支持电解质。
④槽液稳定剂，如避免氧化变质的化合物。
⑤槽液缓冲剂，用以稳定pH值。
⑥改动镀层性质的添加剂，如光亮剂、整平剂等。
⑦阻止惰性阳极溶解或避免消耗性阳极钝化的物质。
一般而言，被镀金属离子在槽液中必须有足够高的浓度，否则不能满足工业要求的电镀速度。当使用不溶 性阳极时，被镀金属离子浓度会随电镀的停止逐渐减小，必须及时补充调整。当使用可溶性阳极时(如镀 铜时用铜阳极)，被镀金属可从阳极失掉补充。为了使阳极平均地溶解，通常在镀槽参加氯离子，但氯离 子的量必须依据镀槽类型严格控制。过量的氯离子在酸性硫酸铜镀槽中是有害的，但少量的氯离子关于镀 铜的整平作用有正面影响。
络合剂通常是一些阴离子，它们与被镀金属离子生成络离子。经历和实际都证明，在相同的电流密度下， 络离子比复杂离子在阴极复原时需要更负的电极电位(更大的过电位)，从而易于失掉由细密晶粒组成的优 良镀层。
在强酸或强碱性槽液中，pH值的控制不太重要；但在中性槽中，pH值的控制十分重要，需要使用缓冲剂。
镀槽的添加剂包括光亮剂、整平剂、减应力剂、镀层增硬剂等，种类单一，需依据详细状况选用。
This article is from:http://www.newstar-china.com
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