1、 Slow deposition speed and poor deep plating ability
1.先查看电流密度的巨细
2.再看阳极是不是钝化,游离NaCN是不是正常
3.溶液是不是被Cr6+污染。
二、镀层有针孔
1.先看基材外表是不是存在粗糙度较大。
2.查看前处理是不是妥当,是不是按要求做到“四无”规范(无油,无锈,无挂灰,无氧化膜)
3.Cu低或游离NaCN过高,镀液析氢较大,剖析镀液成分,调整镀液份额。
4.阴极电流密度大。
5.阳极面积较小。
三、镀层粗糙,色泽暗红
1.色泽暗红,标明阳极也许钝化和镀液中杂质增多,应取出阳极,调查其外表的色彩,并调查阳极邻近溶液是不是发蓝等
A)若阳极外表呈灰白色,则标明镀液中CO32-过高,有也许CN-分化过快。
B)若阳极外表呈黑色膜层,则标明是金属杂质的污染,应该用Na2S和活性炭处理.
2.镀层粗糙,标明镀液Cu+高,游离NaCN缺乏,应剖析化验,调整CuCN,游离NaCN在规范技术范围内。
总之,电镀毛病千变万化,需求咱们平常在工作中多留意调查,多做试验,以验证准确与否。
This article is from:http://www.newstar-china.com/
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